Job Description

Kilby Labs RF Design Intern - Heterogeneously Integrated Advanced Package Modeling The RF Design Intern role is within Kilby Labs, the central R&D organization of Texas Instruments (TI). The lab is chartered to develop novel and innovative technologies and strategies for new business opportunities, drive next generation, differentiated technologies for existing businesses and recruit top technical talent for TI. Responsibilities may include: - Design of high frequency advanced package interconnects using FEM simulators - Analyzing the measurement results of high frequency package interconnects (i.e. CuPillars, solder bumps), study of de-embedding and correlation with simulation results - Development of a thermal model for high power advanced packages using FEM solvers - Development of a mechanical model for advanced package structures using FEM solvers **Why TI?** + Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics. + We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI ( + Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. **About Texas Instruments** Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com . Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, disability, genetic information, national origin, gender, gender identity and expression, age, sexual orientation, marital status, veteran status, or any other characteristic protected by federal, state, or local laws. If you are interested in this position, please apply to this requisition. Minimum Requirements - Currently pursuing Masters or PhD degree in Electrical Engineering or related field with RF Power Amplifier design background and RF/mmWave IC design experience - Cumulative 3.0/4.0 GPA or higher Preferred Qualifications - Experience with high frequency electromagnetic solvers - Experience with thermal and mechanical models using FEM solvers - Understanding the high frequency passive component design - Knowledge of RF measurements and de-embedding **ECL/GTC Required:** Yes

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